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Silicon Deep RIE Systems

We established our deep etching process by combining our proprietary technologies with the Bosch process. Our systems incorporating this technology have been recognized as the de facto standard for silicon deep etching for MEMS manufacturing.

We offer a diverse range of models including the SR for R&D and small production, to Pegasus the standard in mass production. The combination of high-performance hardware with process control software ensures Pegasus delivers an industry-leading etch rate, mask selectivity, and high aspect ratio etching capability. This system can be used in numerous applications, including the manufacture of gyro sensors and acceleration sensors.

photo:Silicon Deep Etching Systems

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