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Silicon Oxide Sacrificial Layer Etching Systems

Sacrificial layer etching is a process unique to the manufacture of MEMS, which contain miniature moving mechanisms. Our systems for dry isotopic etching of the silicon oxide layer are free from stiction, which is a problem with wet etching. We provide systems incorporating a wide range of platforms from simple manual load to cluster systems. These systems provide support for R&D, trial production, and mass production. Multiple systems are already in use for the manufacture of silicon microphones, optical devices, and various other products.

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