MEMS Foundry Development
Because the microstructure, material properties, and process conditions of MEMS devices interact in a complex way, their performance cannot be guaranteed at the design stage alone.
Translating design intent into actual manufacturing processes, and refining it into a mass-producible form through prototyping and evaluation—this is MEMS foundry development (process development).
Our company provides comprehensive support throughout the entire development phase, from initial consultations at the conceptual stage to prototyping, evaluation, and transition to mass production.
Whether you're a first-time MEMS developer or you have design drawings and are looking for a manufacturing partner, we can provide support tailored to your specific situation.
MEMS prototype development is a particularly important step in MEMS foundry development.
We then bring the designed device to life through the actual manufacturing process, verifying its performance, structure, and manufacturing conditions one by one.
Many challenges arise only after actually manufacturing, such as process variations in microfabrication, stress and adhesion of thin films, and reproducibility of etched shapes.
In MEMS prototype development, we repeatedly adjust process conditions based on evaluation results to address these challenges and ensure the required performance and reproducibility.
We provide flexible MEMS prototyping support tailored to your specific needs, from initial verification of new devices to validation of existing designs, re-evaluation due to changes in application, and final verification before mass production.
We can discuss options tailored to your development phase and project scale, such as prototyping only after design completion, or prototyping limited to specific processes.
To accurately reflect design intent in the manufacturing process, our company employs a development system based on close collaboration from the design stage. By designing processes based on structural design and analysis results, we minimize rework during the prototyping phase.
We provide technical consultation from the conceptual stage, and we can support even customers with little experience in MEMS development, from selecting elemental technologies to considering the direction of device structure.
We have established process lines suitable for MEMS prototyping and small-batch production, and we propose the optimal process according to the development phase, from initial prototyping to the manufacturing of evaluation devices.
Because we support phased testing starting with small quantities, it is possible to proceed with development while keeping initial investment low.
We design processes from the prototyping stage with mass production in mind, and proceed with development while considering reproducibility and cost structure during mass production. We organize the conditions and data obtained from prototyping and support a smooth transition to mass production foundry.
We will organize the applications, required performance, and operating environment of MEMS devices to clarify the prerequisites for development.
We will examine the feasibility of your project, taking into account material selection, device structure direction, and anticipated process constraints. We can provide consultation from the elemental technology level, even for research and development applications or new device concepts.
Based on the preconditions established in the previous phase, process analysis will be conducted in parallel with device design.
We design a process that combines elemental technologies such as PZT piezoelectric thin films and Si deep etching (Si DRIE), and then identify which processes affect performance and yield.
Based on the results of the design and process studies, we will create a MEMS prototype.
After prototyping, we adjust the conditions while incorporating feedback from the evaluation results to confirm performance, reproducibility, and stability. We can handle everything from evaluation prototypes for research purposes to prototypes for mass production, tailored to each stage.
Based on the prototype results, we will consider whether to transition to a mass production foundry and the process conditions for mass production.
We will help you smoothly scale up your production by proactively identifying potential challenges during mass production.
We offer custom development services to optimize device structure and processes to suit your specific application. Without being constrained by existing processes, we consider the underlying technologies and propose process configurations that meet your performance requirements.
We also handle small-lot prototyping and production for evaluation purposes and verification before mass production.
We can provide support tailored to each phase, from small-scale prototyping in the early stages of development to gradual scaling up.
We provide each crucial process in MEMS prototyping by leveraging the technological foundations of our company and group companies. For details on specific process technologies, please refer to the following section.
As a MEMS foundry, we provide various process technologies that are crucial for prototyping.
We offer our PZT piezoelectric thin-film process, developed within our group and backed by a proven mass production record, as a MEMS foundry service. We can handle prototyping of piezoelectric MEMS devices and ultrasonic MEMS devices, including PZT deposition and etching processes.
Sensor/MEMS Device Application Examples
Sensor/MEMS Device
Application Examples
We provide MEMS foundry services for Si Deep Etching (Si DRIE). Having developed the world's first mass-production Bosch process Si DRIE equipment, we possess extensive process recipes and production know-how based on many years of experience in mass-production device manufacturing.
Furthermore, low-scallop processing of 100nm or less allows us to handle devices requiring high-precision structures, such as MEMS actuators and ultrasonic MEMS.
Low scalloping: 100mm
High aspect
Tapered
Micro-pillar processing
Two-stage processing
Through-hole straight hole processing
The "ASE-Predeus" high-precision silicon deep drilling machine from the Advanced Process Equipment Division (formerly SPP Technologies Co., Ltd. Co., Ltd.) offers improved in-plane uniformity from ±4% to ±3% and angle control of less than 0.1° in an 8-inch area compared to the conventional ASE-Pegasus.
Silicon deep drilling machine
MUS-21 ASE-Predeus
We offer a variety of process menus tailored to each development phase, including MEMS prototyping, custom development, small-lot production, and mass production preparation, enabling flexible MEMS foundry development according to device specifications.
| process | Process specifications | |
|---|---|---|
| etching | Si deep etching | L/S(min)：1.5μm Hole：φ10μm Maximum aspect ratio：100 Through-hole processing available |
| dry etching | L/S(min)：3μm Metal film, oxide film, SiC, PZT |
|
| sacrificial layer etching | L/S(min)：1μm | |
| Wet etching | Au、AI、Ti、Cr etc | |
| photolithography | regist coat | Film thickness (max)：10μm Uniformity：5％ Can be spray coated |
| Exposure （mirror projection） |
L/S(min)：1.5μm | |
| Exposure （contact） |
L/S(min)：3μm Double-sided exposure possible |
|
| Exposure （stepper） |
L/S(min)：1μm | |
| Development | ||
| Film deposition （sputtering） |
PZT sputtering *1 |
Film thickness: 1～5μm *Standard film thickness: 3μm Relative permittivity: 900 Note1 Piezoelectric constant(d31): 220-240pm/V Note2 The values of Notes 1 and 2 depend on the SSP standard film thickness and film composition. |
| Metal sputtering *2 |
Film thickness: 10nm to 5μm Uniformity: ±10% Au, Pt, AI, Cr, Ti |
|
| Oxide sputtering *3 |
Film thickness: 2μm or less Uniformity: ±10% |
|
| Film deposition (CVD) |
PE-CVD SiO2（TEOS） ※3 |
Film thickness: 10nm to 5μm Uniformity: ±5% |
| PE-CVD SiN ※3 |
Film thickness: 10nm to 5μm Uniformity: ±5% *Stress control possible |
|
| Film deposition (ALD) |
Atomic Layer Deposition ※4 |
AI203 and others |
| Oxidation/annealing | thermal oxidation | Film thickness: 1μm or less Uniformity: 10% Wet/Dry mixture |
| Anneal | ||
| bonding | Anodic bonding (can be sealed) |
Sealing internal pressure: >0.01Pa |
| glass processing | Blasting | L/S(min)：15μm Hole(min)：φ50μm |
| Wet etching | L/S(min)：10μm Depth(max)：300μm |
|
| backend | dicing | |
| back grind | In-plane distribution: 5μm | |
| Evaluation | XRF、EDX Zygo、SEM Surface profilometer Laser microscope etc. |
Wafer size: 4 to 8 inches
Please feel free to contact us regarding processes not listed.
*1 The characteristics of the piezoelectric thin film are typical values for our cantilever.
*2 Please feel free to contact us regarding Au, Pt, Al, Ti, Cr and other metal films.
*3 Insulating film is a typical value for various Film deposition methods. Please contact us for more details.
*4 Please feel free to contact us regarding Al2O3 and other protective films.
We possess all the necessary equipment for MEMS prototyping within our company and group, enabling us to provide consistent prototyping support.
Flexible adjustment of equipment conditions allows us to meet a wide range of needs, from research and development applications to mass production preparations.
We develop various MEMS devices tailored to specific applications and performance requirements. We provide comprehensive development support, from design considerations based on device structure and operating principles to process design focused on prototyping, evaluation, and mass production.
| Categories | Compatible devices and applications | Related technologies and processes |
|---|---|---|
| Ultrasonic MEMS | pMUT (Piezoelectric MEMS Ultrasonic Transducer) / MEMS Ultrasonic Sensor |
PZT piezoelectric thin film/Si DRIE |
| Piezoelectric MEMS | Piezoelectric sensor / Piezoelectric actuator / MEMS speaker |
PZT piezoelectric thin film |
| Other MEMS | Microfluidics/Micro Pillar/ MEMS cooling and other |
Si DRIE |
*The above are typical combinations. We can also advise you on selecting technologies and processes according to your application and required performance.
Piezoelectric MEMS are MEMS devices that utilize the piezoelectric effect for driving and detection, and are used in a wide range of applications, including ultrasonic devices, actuators, and acoustic devices.
Our company provides foundry development support for piezoelectric MEMS devices, from initial design considerations to prototyping and evaluation, and we handle process selection and structural design according to the application and required performance.
Furthermore, we possess a PZT piezoelectric thin-film process used in the manufacturing of piezoelectric MEMS devices, enabling us to provide highly reproducible prototypes with a view to mass production. For details on the PZT piezoelectric thin-film process, please refer to our technology page.
*We also offer consultation on piezoelectric materials and process conditions depending on the application and required characteristics.
Ultrasonic MEMS are devices that realize ultrasonic generation and reception functions in a microstructure, and are used in a wide range of fields such as distance measurement, non-destructive testing, and various sensing applications.
Our company provides foundry development support for ultrasonic MEMS, from initial design considerations to prototyping and evaluation. We perform structural design and process selection according to the application and required characteristics. We handle all phases, from conceptual and specification development to mass production transition planning.
pMUT (piezoelectric MEMS ultrasonic transducer) is a device that uses piezoelectric thin films to transmit and receive ultrasonic waves, and is attracting attention for applications requiring high sensitivity and miniaturization. By utilizing the PZT piezoelectric thin film process and optimizing the film deposition conditions, structural design, and prototyping conditions, we are able to perform highly reproducible prototyping and evaluation.
MEMS ultrasonic sensors are sensor devices used to detect the distance to an object and physical changes with high precision.
Our company provides development support, including operational characteristics analysis and sensitivity evaluation during the design phase, and we optimize characteristics according to the application through prototyping and evaluation.
MEMS speakers are devices that achieve acoustic output using microstructures, and are characterized by their small size, low power consumption, and high efficiency. In the design and prototyping of MEMS speakers, we provide support for prototype development, including functional verification, by conducting evaluation design and setting conditions based on the manufacturing process.
Microfluidics devices and micropilar structures are typical applications utilizing Si deep etching (Si DRIE) technology. They are used in fields requiring microfluidic channels and high aspect ratio structures, such as biotechnology, medicine, and chemical analysis.
Our company leverages high-precision microfabrication using Si DRIE technology to support the prototyping and evaluation of these devices.
MEMS cooling devices are devices that utilize microstructures to control heat, and their applications are progressing, mainly in heat management.
We provide comprehensive support for MEMS cooling, from process planning and prototype design to evaluation assistance, helping you develop devices tailored to your specific application. Please feel free to contact us.
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